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RK-01Two-Phase Cooling System
RK-01™

Let heat flow away on its own

No CDU, no chiller tower. Negative-pressure phase change carries heat out of >45KW cabinets silently, with PUE convergent below 1.08.

<1.08PUE
Data-center efficiency
82%
Energy saved vs air
>3500W
Per-chip cooling
>45KW
Per-cabinet support
Shanghai, ChinaScroll
§ 001The Problem

Industry Status

2024 – 2026

Liquid cooling isn't about better cost-effectiveness: it's about air cooling reaching its limit.

Modern AI chips have pushed past the boundaries of traditional thermal management. When a single chip needs over 1000W of cooling, air isn't an option — it's just a plan that overheats.

The mission of liquid cooling isn't saving money — it's ensuring continuous, stable operation and extended component lifespan, protecting your computing investment. That's why we chose two-phase cooling: not because it's new, but because it's the only approach that can keep pace with chip power growth.

1000W+

New-gen AI chip power

350W

Air cooling limit

Power density gap

Brain vasculature and heat dissipation
RK-01Vascular Cooling

Learning cooling
from cerebral flow.

RK-01's two-phase cooling logic follows the thermal strategy of heat-intensive organs: heat is not suppressed, but continuously carried away through dense channels, circulation, and phase change.

  • 01The brain accounts for about 3-4% of body mass, yet consumes 20-25% of energy; during thinking, it can reach 30-50% of total energy consumption.
  • 02The brain is one of the body's most heat-intensive organs, producing about 16% of total body heat at rest.
  • 03Average brain temperature is about 38.5°C, while deep-brain temperature can reach 40.9°C.
  • 04Dense cerebral vasculature and high blood flow help dissipate heat as cerebral blood flow increases.
  • 05Skin is the main heat-dissipation pathway: circulation and vasodilation raise skin temperature, trigger sweating, and increase cooling.
  • 06At 15°C ambient temperature, heat released from the head can account for one-third of total body heat loss.
§ 002How It Works

Like the body
sweats.

The human body dissipates heat through sweat evaporation. RK-01 mimics this natural mechanism, using phase change to carry heat away in a closed-loop cycle.

  • 01

    Chip heats cold plate

    High-power CPUs and GPUs directly heat the attached two-phase cold plate, supporting >3500W per chip and >5000W for wafer-scale cooling.

  • 02

    Working fluid vaporizes

    Water-based working fluid vaporizes inside the cold plate, rapidly removing substantial heat through phase change — no high-power pump required.

  • 03

    Gas transfers outdoors

    Hot gas transfers naturally through piping to the outdoor condenser, driven by temperature differential — the entire process consumes almost no energy.

  • 04

    Natural condensation cycle

    Outdoor temperature differential condenses gas back to liquid, returning to the reservoir to complete the cycle. That's why we don't need CDUs or chiller towers.

RK-01 liquid cooling backplane

RK-01 liquid cooling backplane — deployed

Key Metrics
<1.08PUE

Industry-leading efficiency

>3500W

Per-chip cooling capacity

>5000W

Wafer-scale cooling capacity

0

CDU/chiller required

§ 003Comparison

Not better.
A different dimension.

Single-phase liquid cooling is mature, but its limitations in high-power scenarios are evident. Two-phase cooling isn't an optimization — it's a solution redesigned from first principles.

Dimension
Single-Phase
RK-01
Cooling capacity
~500W/chip
>3500W/chip
Wafer-scale cooling supports >5000W
Operating pressure
正压high-pressure risk
负压leak-safe
Instant backflow on leaks — no leakage, no burst pipes, zero safety hazard
Auxiliary gear
CDU + 冷水塔building-scale
0extra equipment
No chiller, no CDU (competitors require 100KW+ CDU), with server/cabinet decoupling, multi-cabinet parallel support
Cooling energy
基准air/single-phase
82/24% lower
82% lower than air, 24% lower than single-phase liquid, 40% lower BIDC energy overall
Fluid & maturity
氟/醇类two-phase in R&D
水基液in production
Competitors use non-eco-friendly fluorinated/alcohol-based fluids with pump-driven positive-pressure burst risk, single-phase cooling capped at <1000W, two-phase still in R&D. RK-01 uses eco-friendly water-based fluid, negative-pressure leak-safe & burst-safe, in production
Clogging risk
micro-channel design
no micro-channels
Fundamentally eliminates blood-clot style blockages
Noise level
100-120dB
~65dB
Equivalent to office environment noise
World's first 10-billion-neuron brain-inspired heterogeneous supercomputer — RK-01 liquid cooling deployment

RK-01 two-phase liquid cooling deployed at scale in the world's first 10-billion-neuron brain-inspired heterogeneous supercomputer.

§ 004Exclusive Innovation
PGN1-3500™

3500W fanless
GaN power supply.

Neogenint's proprietary fanless power supply achieves true silent operation through two-phase liquid cooling. Industry-first, paired with RK-01, liberates data centers from 120dB noise floors.

Traditional DC100-120 dB
Down to
RK-01 + 无风扇电源~65 dB

Equivalent to office environment noise level

3500W

High power output

96%

Titanium efficiency

~65dB

Operating noise

0

Fans

Fanless power supply available for separate purchase. Contact sales for custom specifications. Ideal for high-performance computing scenarios requiring silent operation.

§ 005Efficiency

PUE converges
below 1.08.

PUE measures total facility power divided by IT equipment power. 1.0 is the theoretical limit — RK-01 two-phase cooling brings PUE below 1.08.

PUE Comparison
Air cooling1.6
Single-phase1.4
Immersion1.2
RK-01<1.08
Target: approaching 1.0
Energy Savings
82%

Cooling energy saved vs air

24%

Cooling energy saved vs single-phase

40%

BIDC total energy reduction

The latest business-plan baseline also states that a 10B-neuron system can be carried by 180kW across five standard cabinets.

§ 006Pricing

Simple, transparent,
calculated.

Calculated from actual chip power, cabinet scale, and deployment distance. Under the latest product baseline, RK-01 supports PUE below 1.08.

Per-chip cooling
Chip power (W) × Rate
Based on actual chip power
Rack retrofit
Rack count × Retrofit rate
Supports existing DC retrofit
System deployment
Fixed engineering fee
Includes design, install, commission
Annual maintenance
8% of system cost
24/7 support + annual inspection

Final pricing requires site survey. Contact us for custom solutions and detailed quotes.

§ 007Inquiry

Schedule a
site survey.

RK-01 two-phase liquid cooling system is customized to your data center conditions. Fill out the form and we'll arrange an engineer site survey.

What we need

  • Data center location and facility conditions
  • Current IT equipment total heat load
  • Target PUE value
  • Whether existing infrastructure retrofit is needed
§ 007What's next

Ready to let heat
flow away on its own?

Contact us to learn more about RK-01 two-phase cooling system or schedule a site survey with our engineers.

Shanghai, ChinaRK-01 · NEOGENINT – 2026lane_nie@neogenint.com