Let heat flow away on its own
No CDU, no chiller tower. Negative-pressure phase change carries heat out of >45KW cabinets silently, with PUE convergent below 1.08.
Industry Status
2024 – 2026
Liquid cooling isn't about better cost-effectiveness: it's about air cooling reaching its limit.
Modern AI chips have pushed past the boundaries of traditional thermal management. When a single chip needs over 1000W of cooling, air isn't an option — it's just a plan that overheats.
The mission of liquid cooling isn't saving money — it's ensuring continuous, stable operation and extended component lifespan, protecting your computing investment. That's why we chose two-phase cooling: not because it's new, but because it's the only approach that can keep pace with chip power growth.
New-gen AI chip power
Air cooling limit
Power density gap

Learning cooling
from cerebral flow.
RK-01's two-phase cooling logic follows the thermal strategy of heat-intensive organs: heat is not suppressed, but continuously carried away through dense channels, circulation, and phase change.
- 01The brain accounts for about 3-4% of body mass, yet consumes 20-25% of energy; during thinking, it can reach 30-50% of total energy consumption.
- 02The brain is one of the body's most heat-intensive organs, producing about 16% of total body heat at rest.
- 03Average brain temperature is about 38.5°C, while deep-brain temperature can reach 40.9°C.
- 04Dense cerebral vasculature and high blood flow help dissipate heat as cerebral blood flow increases.
- 05Skin is the main heat-dissipation pathway: circulation and vasodilation raise skin temperature, trigger sweating, and increase cooling.
- 06At 15°C ambient temperature, heat released from the head can account for one-third of total body heat loss.
Like the body
sweats.
The human body dissipates heat through sweat evaporation. RK-01 mimics this natural mechanism, using phase change to carry heat away in a closed-loop cycle.
- 01
Chip heats cold plate
High-power CPUs and GPUs directly heat the attached two-phase cold plate, supporting >3500W per chip and >5000W for wafer-scale cooling.
- 02
Working fluid vaporizes
Water-based working fluid vaporizes inside the cold plate, rapidly removing substantial heat through phase change — no high-power pump required.
- 03
Gas transfers outdoors
Hot gas transfers naturally through piping to the outdoor condenser, driven by temperature differential — the entire process consumes almost no energy.
- 04
Natural condensation cycle
Outdoor temperature differential condenses gas back to liquid, returning to the reservoir to complete the cycle. That's why we don't need CDUs or chiller towers.

RK-01 liquid cooling backplane — deployed
Industry-leading efficiency
Per-chip cooling capacity
Wafer-scale cooling capacity
CDU/chiller required
Not better.
A different dimension.
Single-phase liquid cooling is mature, but its limitations in high-power scenarios are evident. Two-phase cooling isn't an optimization — it's a solution redesigned from first principles.

RK-01 two-phase liquid cooling deployed at scale in the world's first 10-billion-neuron brain-inspired heterogeneous supercomputer.
3500W fanless
GaN power supply.
Neogenint's proprietary fanless power supply achieves true silent operation through two-phase liquid cooling. Industry-first, paired with RK-01, liberates data centers from 120dB noise floors.
Equivalent to office environment noise level
High power output
Titanium efficiency
Operating noise
Fans
Fanless power supply available for separate purchase. Contact sales for custom specifications. Ideal for high-performance computing scenarios requiring silent operation.
PUE converges
below 1.08.
PUE measures total facility power divided by IT equipment power. 1.0 is the theoretical limit — RK-01 two-phase cooling brings PUE below 1.08.
Cooling energy saved vs air
Cooling energy saved vs single-phase
BIDC total energy reduction
The latest business-plan baseline also states that a 10B-neuron system can be carried by 180kW across five standard cabinets.
Simple, transparent,
calculated.
Calculated from actual chip power, cabinet scale, and deployment distance. Under the latest product baseline, RK-01 supports PUE below 1.08.
Final pricing requires site survey. Contact us for custom solutions and detailed quotes.
Schedule a
site survey.
RK-01 two-phase liquid cooling system is customized to your data center conditions. Fill out the form and we'll arrange an engineer site survey.
What we need
- Data center location and facility conditions
- Current IT equipment total heat load
- Target PUE value
- Whether existing infrastructure retrofit is needed
Ready to let heat
flow away on its own?
Contact us to learn more about RK-01 two-phase cooling system or schedule a site survey with our engineers.
